bonding material
英 [ˈbɒndɪŋ məˈtɪəriəl]
美 [ˈbɑːndɪŋ məˈtɪriəl]
网络 结合材料; 粘接材料; 粘结材料; 粘合材料; 接合材料
双语例句
- Apply bonding material to the windscreen.
将粘合材料涂在风挡上。 - Bonding material not present if required.
在有要求时，却没有粘贴物质。 - The surface coating of adhesive residue on the window aperture of the body acts as an adhesive base for new bonding material.
车身车窗开口表面残留粘合胶层充当新粘合材料的粘合胶基体。 - Selection of the underlying bonding material generally chromium iron-nickel alloy.
粘接底层材料一般选用铬铁镍合金。 - The rubber asphalt mixture is an asphalt mixture by taking the rubber asphalt as the bonding material to be heated and mixed with the aggregates.
橡胶沥青混合料是指采用橡胶沥青作为结合料与集料加热拌和而得到的一种沥青混合料。 - Bonding Curing Systems and Bonding Performance of Polymer-modified Mortars Study on polyurethane adhesive and the hygroscopic capacity bonding material
聚合物乳液砂浆的粘结养护特性及其粘结性能聚氨酯粘结剂的合成与粘结体吸湿性研究 - Sticky carbon fiber reinforcement: matching bonding material is used, carbon fiber paste it into the concrete structures on the surface of a reinforcement method.
粘碳纤维加固：是采用配套粘接材料，将碳纤维材料粘贴到混凝土构件表面上的一种加固方法。 - Study on polyurethane adhesive and the hygroscopic capacity bonding material Evaluation of the Bond Strength of Different Luting Cements in Root Canal Dentin after Post Space Preparation
聚氨酯粘结剂的合成与粘结体吸湿性研究不同树脂粘固剂粘结根管牙本质后粘结强度的差异 - The experiment result shows that using the silver paste as the die bonding material, the thermal conductivity of power LED is greatly improved. Its thermal resister is 100 ℃/ W lower than that using the epoxy resin as the die bonding material.
研究结果表明：采用银浆作为芯片键合材料可以显著改善功率型LED的热阻系统，同采用环氧胶作为芯片键合材料的功率型LED相比，其热阻下降了约100℃/W。 - A high temperature oxidation resistance ceramic coating at 1 200 ℃ on an FeCrAl-alloy surface was prepared by the melt-sintering method at 1 300 ℃ in air, using a spraying process with a slurry of Cr_ ( 2) O_ ( 3) with bonding material.
用粘结料与Cr2O3制成料浆，用喷涂涂覆于FeCrAl合金表面，在空气中1300℃熔烧制备了耐高温（1200℃）抗氧化陶瓷涂层。 - UV-curing electric conductive adhesive is a new kind bonding material developed in resent years. In this article, the UV-curing mechanism, electric conduction mechanism, adhesive component and the curing equipment are summarized.
紫外光固化导电胶是近年来发展出来的粘合剂新品种，本文主要从紫外光固化导电胶的固化机理、导电机理、组成、固化设备等方面进行综述。 - According to the mechanism of anodic bonding, we made a kind of low melting point glass for bonding material, and have preliminarily finished room temperature anodic bonding experiment.
根据静电封接的机理，配制了一种低温玻璃作为封接材料，初步完成了常温下的静电封接实验。 - Objective To discuss the utilization of Super Bond C& B bonding material in the post crown of anterior teeth with bad root canal shape and structure.
【目的】探讨SuperbondC&B粘接材料在根管形态或结构不良的前牙桩冠修复中的运用。 - The unstability for steam content in the sealed devices is described, it mainly results from water vapor decomposed by bonding material of conductive adhesive under high temperature.
简述了集成电路陶瓷封装内部水汽含量的不稳定性，主要是由粘接材料导电胶在高温下分解释放出的水汽所造成的。 - The experimental results showed that VEA emulsion modified by the adhesion promotor of emulsion rosin, DBP plasticizer and etc is a good bonding material for paper plastic and its bonding property comes up to the standards of the solvent or hot melt bonding agents for paper plastic.
结果表明：经松香乳液增粘剂、DBP增塑剂等改性的VAE乳液是粘接纸塑材料的良好粘合剂，其粘接性能达到了溶剂型加热溶胶型纸塑粘合剂的水平。 - A new self-assembly method was brought up that took place at liquid-liquid interface with solder as the bonding material.
论文提出并实现了一种在两相界面进行的、以低温焊料作为粘合剂的新型自组装方法。 - Microstructure of reactive composite brazing joints of SiC ceramics and Ti alloy by using Ag-Cu-Ti-( Ti+ C) as bonding material
Ag-Cu-Ti-（Ti+C）反应-复合钎焊SiC陶瓷和Ti合金的接头组织 - Experimental Study on Alkali-activated-Fly Ash-Slag Cement as GRC Bonding Material
碱-粉煤灰-矿渣水泥作GRC胶结材的试验研究 - Applying a photopolymer resin instead of thermopolymer resin as a bonding material, a rapid manufacturing of grinding wheel is realized on the basis of rapid prototyping.
将光固化树脂代替热固化树脂作为结合剂，利用快速成型原理实现了砂轮的快速制造。 - The relationships between interfacial shear strength and solid fraction of aluminum alloy at different extrusion ratio are established. The interfacial structure of the bonding material is studied by means of OM.
采用数值模拟与试验相结合的方法，研究了不锈钢包套的变形行为以及铝合金固相率、挤压比对材料复合后界面强度和组织性能的影响，采用光学显微镜对界面组织结构进行了观察分析。 - The viscoelasticity and viscoplasticity of bonding material will result in hysteresis and drift errors to sensor output.
黏合材料的黏弹性和黏塑性将会导致传感器输出的滞后和漂移误差。 - The basic principle of Wafer bonder is to require bonding material applied a series of external conditions, such as pressure, temperature, environment, voltage.
晶圆键合机的基本原理是对需要键合的材料施加一系列的外部条件，比如压力、温度、环境、电压，不同的外部条件可以用来进行不同材料和结构的键合。 - The article screened out the main property indexes of surface protection materials, reinforcing materials and bonding material, and the evaluation method of them was founded. The reasonable evaluation standard was given at the same time.
本文筛选出石质文物表面封护材料、加固材料和粘接材料的主要性能指标，.建立它们的评价方法，提出其合理的评价标准，最后将评价方法和评价标准应用于重庆大足石刻模拟试块。 - The author, on the basis of simulating the failure mechanism of the glazed brick, through the laboratory experiments developed a composite admixture gypsum bonding material with a high bonding strength, good performance of flexible deformation.
基于此，笔者在探究琉璃砖脱落破坏机理的基础上，通过室内试验研发了一种粘结强度高，柔性变形性能好的复合外加剂石膏粘结材料。 - When Ni-Al was used as the bonding material, there are excellent bonding effect between the coating and the substrate.
Ni-Al合金丝作为打底材料时，涂层与基体之间的结合效果较好。 - IR analysis shows that, there is no obvious changes absorption by comparing with waster rubber powder modified asphalt, TOR modified asphalt and pure rubber modified asphalt, it states that chemical modification agent in bonding material system plays a increase soluble role.
IR分析表明，废橡胶粉复合改性沥青和TOR复合改性沥青较纯胶粉改性沥青，没有明显的吸收峰变化，说明化学改性剂在粘合料体系中仅仅起到了增容的作用。